FIRST LEVEL INC.
YORK, PA 17406-6040
Visibility Score
27
Capabilities Narrative
Microelectronic Packaging Precision Component Placement Die Attach Wire Bond-wedge and ball Circuit Board Design and Assembly Stud Bumping Encapsulation Hermetic Lid Sealing Lead Attach Package Design and Assembly
NAICS Codes
| Code | Description | Primary |
|---|---|---|
| 334413 | Semiconductor and Related Device Manufacturing | |
| 334418 | Printed Circuit Assembly (Electronic Assembly) Manufacturing | |
| 334419 | Other Electronic Component Manufacturing |
Keywords
Electronic, Manufacturing, Services, SubContract, Semiconductor, Packaging, Manufacturer, Optoelectronic, Medical, Assembly, COB, Chipscale, Packages, Modules, Wirebond. Diebond, CircuitBoard, PCB, Component, Encapsulation, Multichip, Hybrid, LeadAttach, Studbumping, Micropost
Contact Information
Business Details
- UEI
- NTHPEJSM8F95
- CAGE Code
- 1SXU0
- Year Established
- 2000
- Legal Structure
- Corporation
- Congressional District
- 10